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HANBit
SRAM MODULE 8Mbyte(4M x 16-Bit) 80-Pin SMM 5V Part No. HMS4M16F16G
HMS4M16F16G
GENERAL DESCRIPTION
The HMS4M16F16G is a high-speed static random access memory (SRAM) module containing 4,194,304 words organized in a x16-bit configuration. The module consists of sixteen 1M x 4 SRAMs in TSOP package is mounted on a 80-pin, doublesided, FR4-printed circuit board. The HMS4M16F16 is a SMM(Stackable Memory Module) designed and is intended for mounting into two 40-pin connector sockets. Two decoders are used to select chips and used to enable the module's 4 bytes independently. Output enable (/OE) and write enable (/WE) can set the memory input and output. Data is written into the SRAM memory when write enable (/WE) and chip enable (/CE) inputs are both LOW. Reading is accomplished when /WE remains HIGH and /CE and output enable (/OE) are LOW. For reliability, this SRAM module is designed as multiple power and ground pin. All module components may be powered from a single +5V DC power supply and all inputs and outputs are fully TTL-compatible.
FEATURES
w Access times : 10, 12, 15, 17 and 20ns w High-reliability, high-speed design w Easy memory expansion /CE and /OE functions w Fully Static Operation -- No Clock or Refresh required w FR4-PCB design w High-density 8MByte design w Single + 5V 10% power supply w All inputs and outputs are TTL-compatible w Industry-standard pinout
PIN ASSIGNMENT
40-PIN P1 Connector PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SYMBOL Vcc A0 A1 A2 A3 A4 Vss A5 A6 A7 A8 A9 A10 Vss A11 A12 A13 A14 A15 Vcc PIN 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 SYMBOL Vcc A16 A17 A18 A19 A20 Vss A21 FLOOR_CTRL3 FLOOR_CTRL1 NC FLOOR_CTRL2 /CS0 /CS1 /OE /WE0 /WE1 NC NC Vcc PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40-PIN P2 Connector SYMBOL Vcc DQ0 DQ1 DQ2 DQ3 DQ4 Vss DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 Vss DQ11 DQ12 DQ13 DQ14 DQ15 Vcc PIN 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 SYMBOL Vcc NC NC NC NC NC Vss NC NC NC NC NC NC Vss NC NC NC NC NC Vcc
SMM TOP VIEW
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FUNCTIONAL BLOCK DIAGRAM
DQ0 - DQ15 A0 - A19 A0-A19 /WE /OE A0-A19 /WE /OE
HMS4M16F16G
U2
/CE
DQ0-3 /CE11
U11 DQ0-3
/CE
/CE0l
A0-A19 /WE /OE
U3
/CE
DQ4-7
A0-A19 /WE /OE
U12
/CE
DQ4-7
/CE02
A0-A19 /WE /OE
U4 DQ8-11
/CE /CE12
A0-A19 /WE /OE
U13
/CE
DQ8-11
A0-A19 /WE /OE
U5
/CE
DQ12-15
A0-A19 /WE /OE
U18 DQ12-15
/CE
/CE03
A-A19 /WE /OE
U6
/CE
DQ0-3 /CE13
A0-A19 /WE /OE
U15
/CE
DQ0-3
A0-A19 /WE /OE
U7
/CE
DQ4-7
A0-A19 /WE /OE
U16
/CE
DQ4-7
A0-A19 /WE /OE /CE04 A0-A19 /WE /OE /OE /WE
U8 DQ8-11
/CE /CE14
A0-A19 /WE /OE
U17 DQ8-11
/CE
U9 DQ12-15
/CE
A0-A19 /WE /OE
U18 DQ12-15
/CE
URL: www.hbe.co.kr Rev. 1.0 (September / 2002)
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HMS4M16F16G
A(20) A(21)
A0 A1 OUT1 OUT2 /CE01 /CE02 /CE03 /CE04
/CS0 FLOOR_CTRL1 FLOOR_CTRL2
/E1 E2 E3
OUT3 OUT4
74F138
A(20) A(21)
A0 A1 OUT1 OUT2 /CE11 /CE12 /CE13 /CE14
/CS1
/E1 E2 E3
OUT3 OUT4
74F138
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TRUTH TABLE
MODE STANDBY NOT SELECTED READ WRITE /OE X H L X /CE H L L L /WE X H H L OUTPUT HIGH-Z HIGH-Z DOUT DIN
HMS4M16F16G
POWER STANDBY ACTIVE ACTIVE ACTIVE
ABSOLUTE MAXIMUM RATINGS
PARAMETER Voltage on Any Pin Relative to Vss Voltage on Vcc Supply Relative to Vss Power Dissipation Storage Temperature Operating Temperature SYMBOL VIN,OUT VCC PD TSTG TA RATING -0.5V to +7.0V -0.5V to +7.0V 16W oC to +150oC -65 0oC to +70oC
w Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS ( TA=0 to 70 o C )
PARAMETER Supply Voltage Ground Input High Voltage Input Low Voltage * SYMBOL VCC VSS VIH VIL MIN 4.5V 0 2.2 -0.5* TYP. 5.0V 0 MAX 5.5V 0 Vcc+0.5V** 0.8V
VIL(Min.) = -2.0V ac (Pulse Width 10ns) for I 20 mA
** VIH(Min.) = Vcc+2.0V ac (Pulse Width 10ns) for I 20 mA
DC AND OPERATING CHARACTERISTICS (1)(0oC TA 70 oC ; Vcc = 5V 0.5V )
PARAMETER Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage * Vcc=5.0V, Temp=25 oC TEST CONDITIONS VIN =Vss to Vcc /CE=VIH or /OE =VIH or /WE=VIL VOUT=Vss to VCC IOH = -4.0Ma IOL = 8.0Ma SYMBOL ILI IL0 VOH VOL MIN -32 -32 2.4 0.4 MAX 32 32 UNITS A A V V
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DC AND OPERATING CHARACTERISTICS (2)
DESCRIPTION TEST CONDITIONS Min. Cycle, 100% Duty /CE=VIL, VIN=VIH or VIL, IOUT=0mA Min. Cycle, /CE=VIH f=0MHZ, /CEVCC-0.2V, VIN VCC-0.2V or VIN0.2V lSB lSB1 960 160 960 160 lCC 2560 2400 SYMBOL MAX -10 -12
HMS4M16F16G
-15 2240
UNIT
Power Supply Current: Operating Power Supply Current :Standby
mA
960 160
mA mA
CAPACITANCE
DESCRIPTION Input /Output Capacitance Input Capacitance TEST CONDITIONS VI/O=0V VIN=0V SYMBOL CI/O CIN MAX 128 112 UNIT pF pF
* NOTE : Capacitance is sampled and not 100% tested
AC CHARACTERISTICS (0oC TA 70 oC ; Vcc = 5V 0.5V, unless otherwise specified) TEST CONDITIONS
PARAMETER Input Pulse Level Input Rise and Fall Time Input and Output Timing Reference Levels Output Load VALUE 0 to 3V 3ns 1.5V See below
Output Load (A) VL=1.5V 50 DOUT Z0=50 DOUT 30pF 255
Output Load (B) for tHZ, tLZ, tWHZ, tOW, tOLZ & tOHZ +5.0V 480 5pF*
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READ CYCLE
-10 PARAMETER Read Cycle Time Address Access Time Chip Select to Output Output Enable to Output Chip Enable to Low-Z Output Output Enable to Low-Z Output Output Disable to High-Z Output Chip Disable to High-Z Output Output Hold from Address Change Chip Select to Power Up Time Chip Select to Power Down Time SYMBOL MIN tRC tAA tCO tOE tLZ tOLZ tOHZ tHZ tOH tPU tPD 10 3 0 0 0 3 0 MAX 10 10 5 5 5 10 MIN 12 3 0 0 0 3 0 MAX 12 12 6 6 6 12 -12
HMS4M16F16G
-15 UNIT MIN 15 3 0 0 0 3 0 MAX 15 15 7 7 7 15 ns ns ns ns ns ns ns ns ns ns ns
WRITE CYCLE
PARAMETER Write Cycle Time Chip Select to End of Write Address Set-up Time Address Valid to End of Write Write Pulse Width (/OE High) Write Recovery Time Write to Output High-Z Data to Write Time Overlap Data Hold from Write Time End of Write to Output Low-Z SYMBOL tWC tCW tAS tAW tWP tWR tWHZ tDW tDH tOW -10 MIN 10 7 0 7 7 0 0 5 0 3 MAX 5 MIN 12 8 0 8 8 0 0 6 0 3 -12 MAX 6 MIN 15 10 0 10 10 0 0 7 0 3 -15 MAX 7 UNIT ns ns ns ns ns ns ns ns ns ns
TIMING DIAGRAMS Please refer to timing diagram chart(II)
FUNCTIONAL DESCRIPTION /CE H L L L /WE X* H H L /OE X H L X MODE Not Select Output Disable Read Write I/O PIN High-Z High-Z DOUT DIN SUPPLY CURRENT I SB, I SB1 ICC ICC ICC
Note: X means Don't Care
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HMS4M16F16G
ORDERING INFORMATION
Part Number Density Org. Package Component Number 16EA 16EA 16EA 16EA 16EA Vcc SPEED
HMS4M16F16G-10 HMS4M16F16G-12 HMS4M16F16G-15 HMS4M16F16G-17 HMS4M16F16G-20
8MByte 8MByte 8MByte 8MByte 8MByte
4Mx16bit 4Mx16bit 4Mx16bit 4Mx16bit 4Mx16bit
80Pin-SMM 80Pin-SMM 80Pin-SMM 80Pin-SMM 80Pin-SMM
5.0V 5.0V 5.0V 5.0V 5.0V
10ns 12ns 15ns 17ns 20ns
PACKAGE DIMENSIONS Unit : mm
150.00 0.2 3.15 5.08 0.2 5.08 0.2 3.15
1 20.20 20
21
1
21 26.50 0.2
40 P1
20 P2
40
3.15
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3.15
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HMS4M16F16G
4.6
Connector Configuration - Module PCB Bottom: 177985-1(AMP), 0.8mm Free Height Plugs, 40pins - Board top: 177986-1(AMP), 0.8mm Free Height Receptacles ,40pins
URL: www.hbe.co.kr Rev. 1.0 (September / 2002)
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